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SW16025 - 

Desoldering Braid, Soder-Wick®, No-Clean, Static Dissipative Bobbins, 1.5mm x 5 ft, Pack of 10

CHEMTRONICS SW16025

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Artikelnr. fabrikant:
SW16025
Ordercode:
957161
Technische datasheet:
(EN)
Bekijk alle technische documenten

Productgegevens

:
1.524m
:
-
:
Oxygen Free Copper
:
1.5mm
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Productoverzicht

The SW16025 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.
  • Yellow label on SD bobbin
  • Minimizes the risk of damage associated with static electricity
  • Patented non-corrosive, halide-free and organic no-clean flux
  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Requires little or no post solder cleaning
  • No corrosive residues
  • Minimal risk of heat and static component damage
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance
  • Packaged in ESD-safe static dissipative bobbins

Toepassingen

Maintenance & Repair

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