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delivers a complete portfolio of DOWSIL(tm) and SYLGARD(tm) silicone-based technology and other high-performance materials for electronics applications. For more than 70 years, Dow has been offering proven, innovative solutions for assembly, bonding, sealing, potting, thermal management, electromagnetic compatibility (EMC) and many other challenging uses across the industry’s supply chain. Read more
Many of our materials have been UL-recognized, and all of our efforts are informed by Dow’s sustainability goals. Our materials enhance durability and extend the life cycle of parts. We’re also reducing energy consumption by designing materials that cure at room temperature instead of using ovens. From factory tablets to smartwatches to connected kitchen appliances, Dow is helping to optimize the reliability, protection, safety, and aesthetics of next-generation communications and consumer electronics.
Headquartered in Michigan, USA, we maintain manufacturing sites, a network of technical experts, sales and customer service offices, and research and development labs in every major geographic market worldwide to ensure you receive fast, reliable support for your processing and application development needs.
To find out how we can support your applications, visit www.dow.com/electronics
Call our dedicated team at 030-2417337 or send us your requirements online.
Request a Quote todayA two-part, fast room temperature cure adhesive offering tunable reactivity, better and faster robust primerless adhesion to plastics, metals, glass and many more materials.
One-part, translucent, medium viscosity, UV and moisture dual curable coating. Designed for automated spray processing for high volume production, DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating reduces work-in-progress.
Suitable for encapsulating rigid and flexible circuit boards for indoor and outdoor LED Lighting, explosion proof and high ingress protection rated luminaire as well as outdoor displays applications and for space grade applications. Room temperature curing with optional heat acceleration.
A high performance, one-part non-curable, dispensable, thermally conductive gap filler with 5 W/mK thermal conductivity developed to conduct heat from electronics to a heat sink.
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