GC 50 SAC305 T5 84V 62K

Loctite GC 50 solder paste is a halogen free, no-clean, Pb-free solder paste specially designed to provide enhanced stability when used in jetting and other dispensing applications.

• Provides added long-term stability over a wide range of temperature conditions
• Cpk <gt/>2.0 achievable with less than 50% tolerance
• High process capability for paste diameter targets of <lt/>300μm using jetting technology
• Optimized rheology suitable for solder paste jetting technology with process stability up to 28°C (82°F)
• Stable in ejector head for at least 1 week (up to 28°C/82°F)
• Suitable for use in time/pressure and auger pump dispensing systems
• Void-free packaging for improved process consistency and sustainability
• Stable at room temperature for enhanced sustainability
• Excellent soldering performance in air or in nitrogen
• Good resistance to graping in demanding reflow profiles
• IPC Class III voiding performance
• Post reflow residues readily removed with electronics industry solvents
• Compatible with Pb-free printing pastes in a solder additive process
• Eliminates the need for step-stencil or preforms