4900P-25G

4900P-25G is a no clean solder paste. It is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces. 4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3mm. Store refrigerated between 2–10°C in an upright position with tip down to prevent flux separation and air entrapment.

• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Repeatable and consistent printing characteristics
• Excellent wettability, long stencil and tack life facilitate high speed printing
• Shelf life of 1 year (2–10˚C), 6 months (20–25˚C)-unopened container
• Suitable for air or nitrogen atmospheres
• Medium-soft, non-cracking residues
• ROL0 flux classification, rosin flux type, low flux activity
• 5.5% post reflow flux residue, 2.0 x 10¹⁰ ohm SIR
• 3.38mL net volume, syringe packaging

Notes

Apply heat using a heat gun. Clean tip to prevent contamination and material buildup.